Semiconductor devices—Micro-electromechanical devices—Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
Execute Date: february 2027

Standard published on 30.7.2026

Semiconductor devices—Micro-electromechanical devices—Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
Execute Date: february 2027

Standard published on 30.7.2026

Semiconductor devices—Micro-electromechanical devices—Part 40: Test methods of MEMS inertial shock switch threshold
Execute Date: february 2027

Standard published on 30.7.2026

Semiconductor devices—Micro-electromechanical devices—Part 6: Axial fatigue testing methods of thin film materials
Execute Date: february 2027

Standard published on 30.7.2026

Semiconductor devices—Micro-electromechanical devices—Part 8: Strip bending test method for tensile property measurement of thin films
Execute Date: february 2027

Standard published on 30.7.2026

Marine electromagnetic logs
Execute Date: february 2027

Standard published on 2.7.2026

Three dimensional integrated circuits—Part 3Model and measurement methods of through-silicon via
Execute Date: february 2027

Standard published on 30.7.2026

Practice for determining semiconductor wafer near-edge geometry—Part 3:Sector area flatness(ESFQRESFQDESBIR
Execute Date: february 2027

Standard published on 2.7.2026

Plastics piping systems for renovation of underground water supply networks—Part 2: Lining with continuous pipes
Execute Date: february 2027

Standard published on 30.7.2026

Ferrite cores—Guidelines on dimensions and the limits of surface irregularities—Part 10PM-cores and associated parts
Execute Date: february 2027

Standard published on 30.7.2026