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Standards GB are Chinese national standards, which are issued by China's Standardization Administration Office (SAC).
Chinese national standards are used all over China commonly labeled as GB standards. They determine the united production requirements regarding product safety and quality .
GB standards are often modified or created according to the international standards of ISO, IEC or any other international level.
Although, they are largely harmonized, GB standards may differ from international standards .
Approximately 15% of all GB standards are obligatory and they can be identified according to the prefix GB, after which the code of the standards follows:
GB – Obligatory national standards
GB/T – Optional national standards
GB/Z – National steering technical document
Electronics assembly technology—Part 4: Endurance test methods for solder joint of area array type package surface mount devices
Standard published on 30.5.2025
Selected format:Printed circuit board materials—Part 5-4:Sectional specification set for conductive foils and films with or without coatings—Conductive pastes
Standard published on 30.5.2025
Selected format:Multimedia systems and equipment for vehicles—Surround view system—Part 1: General
Standard published on 30.5.2025
Selected format:Multimedia systems and equipment for vehicles—Surround view system—Part 2: Recording methods of the surround view system
Standard published on 30.5.2025
Selected format:Semiconductor devices—Bias temperature instability test for metal-oxide semiconductor field-effect transistors (MOSFETs)
Standard published on 30.5.2025
Selected format:
Semiconductor devices—Bias-temperature instability test for metal-oxide semiconductor field-effect transistors (MOSFETs)—Part 1: Fast bias-temperature instability test for MOSFETs
Execute Date: november 2026
Standard published on 30.4.2026
Selected format:Information technology—Software measurement—Software quality measurement—Automated source code quality measures
Standard published on 30.5.2025
Selected format:Semiconductor devices—Time dependent dielectric breakdown (TDDB) test for inter-metal layers
Standard published on 30.5.2025
Selected format:Semiconductor devices—Hot carrier test on metal-oxide semiconductor(MOS) transistors
Standard published on 30.5.2025
Selected format:Semiconductor devices—Time dependent dielectric breakdown (TDDB) test for gate dielectric films
Standard published on 30.5.2025
Selected format:Latest update: 2026-08-28 (Number of items: 2 298 625)
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