Standards GB - Chinese national standards - Page 571

Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Standard published on 30.8.2019

Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits

Standard published on 17.9.2018

Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)

Standard published on 23.5.2023

Mechanical standardization of semiconductor devices—Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guidelines for fine-pitch land grid array (FLGA)
Execute Date: july 2026

Standard published on 31.12.2025

Medical glass thermometer

Standard published on 29.4.2024

Potentiometers for use in electronic equipment--Part 3:Sectional specification--Rotary precision potentiometers

Standard published on 22.12.1995

Potentiometers for use in electronic equipment--Part 3:Blank detail specification--Rotary precision potentiometers--Assessment level E

Standard published on 22.12.1995

R.F. coaxial connectors type C

Standard published on 22.12.1995

R.F. coaxial connectors type UHF

Standard published on 22.12.1995

Limits of dimensions, axle load and masses for motor vehicles,trailers and combination vehicles

Standard published on 26.7.2016