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Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
WITHDRAWN published on 1.3.2009
Selected format:Zkoušení vlivů prostředí - Část 2-21: Zkoušky - Zkouška U: Pevnost vývodů a jejich neoddělitelných upevňovacích částí. (Platnost do 1.7.2009).
WITHDRAWN published on 1.1.2000
Selected format:Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
WITHDRAWN published on 1.3.2007
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WITHDRAWN published on 1.10.1992
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WITHDRAWN published on 5.1.1989
Selected format:Basic environmental testing procedures. Part 2: Tests. Test Ea and quidance: Shock
WITHDRAWN published on 1.12.1995
Selected format:Elektrotechnické a elektronické výrobky. Základní zkoušky vlivu vnějších činitelů prostředí. Část 2-28: Návod pro zkoušky vlhkým teplem.
WITHDRAWN published on 1.3.1992
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WITHDRAWN published on 5.1.1989
Selected format:Basic environmental testing procedures. Part 2: Tests. Test Eb and guidance: Bump
WITHDRAWN published on 1.12.1995
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WITHDRAWN published on 18.5.1989
Selected format:Latest update: 2026-09-18 (Number of items: 2 301 509)
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