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Standards DIN - German national standards - Page 16539
DIN is a protected designation of German national technical standards.
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E DIN EN 60749-16:2002-05
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Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) test.
(Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 16: Nachweisprüfung für das Teilchenaufprallgeräusch (PIND-Prüfung).)
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E DIN EN 60749-17:2002-05
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Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation.
(Halbleiterbauelemente - Mechanische und Klimatische Prüfverfahren - Teil 17: Neutronenbestrahlung.)
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DIN EN 60749-17:2003-09
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Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation.
(Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 17: Neutronenbestrahlung.)
WITHDRAWN published on 1.9.2003
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E DIN EN 60749-17:2018-07
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VDE 0884-749-17. Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation.
(VDE 0884-749-17. Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 17: Neutronenbestrahlung.)
WITHDRAWN published on 1.7.2018
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E DIN EN 60749-18:2002-05
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Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionising Radiation (total dose); Test procedure.
(Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 18: Ionisierende Strahlung (Gesamtdosis); Prüfverfahren.)
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DIN EN 60749-18:2003-09
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Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose).
(Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 18: Ionisierende Strahlung (Gesamtdosis).)
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E DIN EN 60749-18:2018-10
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Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose).
(Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 18: Ionisierende Strahlung (Gesamtdosis).)
WITHDRAWN published on 1.10.2018
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E DIN EN 60749-19:2002-05
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Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test.
(Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 19: Prüfung der Chip-Bondfestigkeit.)
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DIN EN 60749-19:2003-10
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Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength.
(Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 19: Prüfung der Chip-Bondfestigkeit.)
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E DIN EN 60749-19/A1:2009-10
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Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength.
(Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 19: Prüfung der Chip-Bondfestigkeit.)
WITHDRAWN published on 1.10.2009
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