DIN - German national standards  - Page 16572

Standards DIN - German national standards - Page 16572

DIN is a protected designation of German national technical standards.

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DIN EN 60749-7:2003-04 WITHDRAWN

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases.
(Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 7: Messung des inneren Feuchtegehaltes und Analyse von anderen Restgasen.)

WITHDRAWN published on 1.4.2003

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63.90 USD


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E DIN EN 60749-7:2009-10 WITHDRAWN

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases.
(Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 7: Messung des inneren Feuchtegehaltes und Analyse von anderen Restgasen.)

WITHDRAWN published on 1.10.2009

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79.60 USD


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DIN EN 60749-9:2003-04 WITHDRAWN

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking.
(Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 9: Beständigkeit der Kennzeichnung.)

WITHDRAWN published on 1.4.2003

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63.90 USD


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E DIN EN 60749-9:2016-09 WITHDRAWN

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking.
(Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 9: Beständigkeit der Kennzeichnung.)

WITHDRAWN published on 1.9.2016

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63.90 USD


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DIN IEC 60749:1987-09 WITHDRAWN

Semiconductor devices; mechanical and climatic test methods; identical with IEC 60749, edition 1984.
(Halbleiterbauelemente; Mechanische und klimatische Prüfverfahren.)

WITHDRAWN published on 1.9.1987

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96.30 USD


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DIN EN 60749:2000-02 WITHDRAWN

Semiconductor devices - Mechanical and climatic test methods.
(Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren.)

WITHDRAWN published on 1.2.2000

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132.80 USD


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DIN EN 60749:2001-09 WITHDRAWN

Semiconductor devices - Mechanical and climatic test methods.
(Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren.)

WITHDRAWN published on 1.9.2001

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159.40 USD


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DIN EN 60749:2002-09 WITHDRAWN

Semiconductor devices - Mechanical and climatic test methods.
(Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren.)

WITHDRAWN published on 1.9.2002

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184.50 USD


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E DIN 6075-1:1995-06 WITHDRAWN

Means of packaging - Bottles - Part 1: Vichy-shape 1.
(Packmittel - Flaschen - Teil 1: Vichyform 1.)

WITHDRAWN published on 1.6.1995

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47.60 USD


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DIN 6075-1:1997-05 WITHDRAWN

Means of packaging - Bottles - Part 1: Vichy-shape 1.
(Packmittel - Flaschen - Teil 1: Vichyform 1.)

WITHDRAWN published on 1.5.1997

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