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DIN - German national standards - Page 17154

Standards DIN - German national standards - Page 17154

DIN is a protected designation of German national technical standards.

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Preview E DIN EN IEC 61760-1:2020-10 1.10.2020
E DIN EN IEC 61760-1:2020-10 WITHDRAWN

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs).
(Oberflächenmontagetechnik - Teil 1: Genormtes Verfahren zur Spezifizierung oberflächenmontierbarer Bauelemente (SMDs).)

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Preview DIN EN 61760-2:1998-11 1.11.1998
DIN EN 61760-2:1998-11 WITHDRAWN

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide.
(Oberflächenmontagetechnik - Teil 2: Transport- und Lagerungsbedingungen von oberflächenmontierbaren Bauelementen (SMD) - Anwendungsleitfaden.)

WITHDRAWN published on 1.11.1998

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Preview E DIN IEC 61760-2:2004-09 1.9.2004
E DIN IEC 61760-2:2004-09 WITHDRAWN

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide.
(Oberflächenmontagetechnik - Teil 2: Transport- und Lagerungsbedingungen von oberflächenmontierbaren Bauelementen (SMD) - Anwendungsleitfaden.)

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Preview DIN EN 61760-2:2007-10 1.10.2007
DIN EN 61760-2:2007-10 WITHDRAWN

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide.
(Oberflächenmontagetechnik - Teil 2: Transport- und Lagerungsbedingungen von oberflächenmontierbaren Bauelementen (SMD) - Anwendungsleitfaden.)

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Preview E DIN EN IEC 61760-2:2020-11 1.11.2020
E DIN EN IEC 61760-2:2020-11 WITHDRAWN

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide.
(Oberflächenmontagetechnik - Teil 2: Transport- und Lagerungsbedingungen von oberflächenmontierbaren Bauelementen (SMD) - Anwendungsleitfaden.)

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Preview E DIN IEC 61760-3:2008-09 1.9.2008
E DIN IEC 61760-3:2008-09 WITHDRAWN

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering.
(Oberflächenmontagetechnik - Teil 3: Genormtes Verfahren zur Spezifizierung von Durchsteckmontage-Bauelementen für das Aufschmelzlöten (THR).)

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Preview DIN EN 61760-3:2010-12 1.12.2010
DIN EN 61760-3:2010-12 WITHDRAWN

Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering.
(Oberflächenmontagetechnik - Teil 3: Genormtes Verfahren zur Spezifizierung von Durchsteckmontage-Bauelementen für das Aufschmelzlöten (THR).)

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Preview E DIN EN IEC 61760-3:2019-12 1.12.2019
E DIN EN IEC 61760-3:2019-12 WITHDRAWN

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering.
(Oberflächenmontagetechnik - Teil 3: Genormtes Verfahren zur Spezifizierung von Durchsteckmontage-Bauelementen für das Aufschmelzlöten (THR).)

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Preview E DIN EN 61760-4:2012-12 1.12.2012
E DIN EN 61760-4:2012-12 WITHDRAWN

Classification, packaging, labelling and handling of moisture sensitive devices.
(Klassifikation, Verpackung, Kennzeichnung und Handhabung feuchteempfindlicher Bauteile.)

WITHDRAWN published on 1.12.2012

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Preview DIN EN 61760-4:2016-03 1.3.2016
DIN EN 61760-4:2016-03 WITHDRAWN

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices.
(Oberflächenmontagetechnik - Teil 4: Klassifikation, Verpackung, Kennzeichnung und Handhabung feuchteempfindlicher Bauteile.)

WITHDRAWN published on 1.3.2016

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