Determining the machine capability of dispensing systems.
(Bestimmung der Maschinenfähigkeit von Dispenssystemen.)

WITHDRAWN published on 1.3.2002

Technical procurement specification; alumina substrates for thick-film circuits.
(Technische Liefervorschrift; Aluminiumoxid-Substrate für Dickschichtschaltungen.)

WITHDRAWN published on 1.7.1993

Technical procurement specification - Thick-film resistor pastes.
(Technische Liefervorschrift - Widerstandspasten für Dickschichtschaltungen.)

WITHDRAWN published on 1.11.1995

Technical procurement specification - Thick-film dielectric pastes.
(Technische Liefervorschrift - Dielektrische Pasten für Dickschichtschaltungen.)

WITHDRAWN published on 1.11.1995

Technical procurement specification; electrically conducting adhesives.
(Technische Liefervorschrift; Elektrisch leitende Kleber.)

WITHDRAWN published on 1.2.1994

Technical procurement specification; electrically non-conductive adhesives.
(Technische Liefervorschrift; Elektrisch isolierende Kleber.)

WITHDRAWN published on 1.2.1994

Technical procurement specification - Solder pastes.
(Technische Liefervorschrift - Lotpasten.)

WITHDRAWN published on 1.11.1995

Technical procurement specification - Epoxy encapsulants for semiconductor chips.
(Technische Liefervorschrift - Epoxidabdeckmassen für Halbleiterchips.)

WITHDRAWN published on 1.3.1995

SMD - Surface Mount Devices - Process measurement and testing for printed circuit boards (PCB).
(Prozeßmeß- und Prüftechnik für Leiterplattenbaugruppen in SMD-Technik.)

WITHDRAWN published on 1.5.1995

Mask engineering; introduction, terms and definitions.
(Maskentechnik; Einführung, Begriffe und Definitionen.)

WITHDRAWN published on 1.12.1985