VDE - German standards - Page 402

Standards VDE - German standards - Page 402

VDE - German association for electrotechnics, electronics and information technologies was founded as early as 1893. It supports modern education for professionals and high acceptance by people. It supports development of electrotechnics, electronics and information technologies and related technologies.
The main task of the association lies in safety in electrotechnics, elaboration of respected technical rules such as national and international standards, tests and certification of equipment and systems.
American version of VDE standards is marked as UL standard (Underwriters Laboratories).

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DIN EN 62433-2:2017-10

VDE 0847-33-2. EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE).
(VDE 0847-33-2. EMV-IC-Modellierung - Teil 2: Modelle integrierter Schaltungen für die Simulation des Verhaltens bei elektromagnetischer Beeinflussung - Modellierung leitungsgeführter Aussendungen (ICEM-CE).)

Standard published on 1.10.2017

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DIN EN 62433-3:2017-10

VDE 0847-33-3. EMC IC modelling - Part 3: Models of Integrated Circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE).
(VDE 0847-33-3. EMV-IC-Modellierung - Teil 3: Modelle integrierter Schaltungen für die Simulation des Verhaltens bei elektromagnetischer Beeinflussung - Modellierung von abgestrahlten Aussendungen (ICEM-RE).)

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DIN EN 62433-4:2017-05

VDE 0847-33-4. EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI).
(VDE 0847-33-4. EMV-IC-Modellierung - Teil 4: Modelle integrierter Schaltungen für die Simulation des Verhaltens der HF-Störfestigkeit - Modellierung der Störfestigkeit gegen leitungsgeführte Störungen (ICIM-CI).)

Standard published on 1.5.2017

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DIN EN IEC 62433-6:2024-12

VDE 0847-33-6. EMC IC modelling - Part 6: Models of integrated circuits for pulse immunity behavioural simulation - Conducted pulse immunity modelling (ICIM-CPI).
(VDE 0847-33-6. EMV-IC-Modellierung - Teil 6: Modelle integrierter Schaltungen für die Simulation des Verhaltens bei Störfestigkeit gegen Impulse - Modellierung der Störfestigkeit gegen leitungsgeführte Impulse (ICIM-CPI).)

Standard published on 1.12.2024

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DIN EN 62435-1:2017-10

VDE 0884-135-1. Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General.
(VDE 0884-135-1. Elektronische Bauteile - Langzeitlagerung elektronischer Halbleiterbauelemente - Teil 1: Allgemeines.)

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DIN EN 62435-2:2017-10

VDE 0884-135-2. Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms.
(VDE 0884-135-2. Elektronische Bauteile - Langzeitlagerung elektronischer Halbleiterbauelemente - Teil 2: Schädigungsmechanismen.)

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DIN EN IEC 62435-3:2022-05

VDE 0884-135-3. Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data.
(VDE 0884-135-3. Elektronische Bauteile - Langzeitlagerung elektronischer Halbleiterbauelemente - Teil 3: Daten.)

Standard published on 1.5.2022

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DIN EN IEC 62435-4:2019-05

VDE 0884-135-4. Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage.
(VDE 0884-135-4. Elektronische Bauteile - Langzeitlagerung elektronischer Halbleiterbauelemente - Teil 4: Lagerung.)

Standard published on 1.5.2019

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DIN EN 62435-5:2017-10

VDE 0884-135-5. Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices.
(VDE 0884-135-5. Elektronische Bauteile - Langzeitlagerung elektronischer Halbleiterbauelemente - Teil 5: Chip- und Wafererzeugnisse.)

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DIN EN IEC 62435-6:2019-04

VDE 0884-135-6. Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or finished devices.
(VDE 0884-135-6. Elektronische Bauteile - Langzeitlagerung elektronischer Halbleiterbauelemente - Teil 6: Bauelemente in Gehäusen oder fertiggestellte Bauelemente.)

Standard published on 1.4.2019

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