Device embedded substrate - Part 2-2: Guidelines - Electrical testing
(Substrat avec appareil(s) integre(s) - Partie 2-2: Directives - Essai electrique)

Standard published on 4.12.2015

Device embedded substrate - Part 2-3: Guidelines - Design guide
(Substrat avec appareil(s) integre(s) - Partie 2-3: Directives - Guide de conception)

Standard published on 27.3.2015

Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
(Substrat avec appareil(s) integre(s) - Partie 2-4: Directives - Groupes d´elements d´essai (TEG))

Standard published on 27.3.2015

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
(Technologie d’ensemble avec appareil(s) integre(s) - Partie 2-5 : Lignes directrices - Mise en ouvre d’un format de donnees 3D pour un substrat avec appareil(s) integre(s))

Standard published on 16.9.2019

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
(Techniques d’assemblage avec appareil(s) integre(s) - Partie 2-602: Lignes directrices pour un empilement de modules electroniques - Methode d’evaluation de la connectivite electrique entre modules)

Standard published on 22.6.2021

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
(Techniques d’assemblage avec appareil(s) integre(s) - Partie 2-603: Lignes directrices pour un empilement de modules electroniques - Methode d’essai de la connectivite electrique entre modules)

Standard published on 25.2.2025

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

Standard published on 20.3.2019

Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate

Standard published on 7.7.2021

Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries

Standard published on 27.4.2022

Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard

Standard published on 23.8.2017