Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
(Technologie d’ensemble avec appareil(s) integre(s) - Partie 2-5 : Lignes directrices - Mise en ouvre d’un format de donnees 3D pour un substrat avec appareil(s) integre(s))

Standard published on 16.9.2019

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
(Techniques d’assemblage avec appareil(s) integre(s) - Partie 2-602: Lignes directrices pour un empilement de modules electroniques - Methode d’evaluation de la connectivite electrique entre modules)

Standard published on 22.6.2021

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
(Techniques d’assemblage avec appareil(s) integre(s) - Partie 2-603: Lignes directrices pour un empilement de modules electroniques - Methode d’essai de la connectivite electrique entre modules)

Standard published on 25.2.2025

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

Standard published on 20.3.2019

Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate

Standard published on 7.7.2021

Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries

Standard published on 27.4.2022

Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard

Standard published on 23.8.2017

Cause and effect matrix
(Matrice des causes et effets)

Standard published on 10.10.2018

Corrigendum 1 - Cause and effect matrix
(Corrigendum 1 - Matrice des causes et effets)

Correction published on 23.4.2019

Hydraulic machines - Francis turbine pressure fluctuation transposition

Standard published on 18.9.2020