Amendment 1 - Printed electronics - Part 201: Materials - Substrates

Change published on 15.11.2018

Printed electronics - Part 201: Materials - Substrates

Standard published on 15.11.2018

Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer

Standard published on 16.8.2023

Printed electronics - Part 202-11: Materials - Conductive ink - Measurement method of electrical resistance uniformity for large area printed conductive layer

Standard published on 23.4.2025

Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method

Standard published on 16.1.2019

Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)

Standard published on 22.10.2021

Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate

Standard published on 28.9.2018

Printed electronics - Part 202-6: Materials - Conductive ink - Measurement method for resistance changes under high temperature and humidity - Printed conductive layer on a flexible substrate

Standard published on 4.12.2020

Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method

Standard published on 3.3.2021

Printed electronics - Part 202-8: Materials - Conductive ink - Measurement of difference in resistance of printing direction of conductive film fabricated with wire-shaped materials

Standard published on 15.3.2024