Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-7: Materiaux de base renforces, plaques et non plaques - Feuille stratifiee tissee de verre E avec de la resine epoxyde, d´inflammabilite definie (essai de combustion verticale), plaquee cuivre)

Standard published on 5.3.2002

Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-8: Materiaux de base renforces, plaques et non plaques - Feuilles stratifiees renforcees en tissu de fibres de verre epoxyde brome modifie, d´inflammabilite definie (essai de combustion verticale), plaquees cuivre)

Standard published on 27.2.2003

Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-9: Materiaux de base renforces, plaques et non plaques - Feuilles stratifiees renforcees en tissu de verre de type E epoxyde, modifie ou non, et bismaleimide/triazine, d´inflammabilite definie (essai de combustion verticale), plaquees cuivre)

Standard published on 27.2.2003

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 3-3: Collection de specifications intermediaires pour les materiaux de base non renforces, recouverts ou non (prevus pour les circuits imprimes flexibles) - Film flexible de polyester a revetement adhesif)

Standard published on 10.2.1999

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 3-4: Collection de specifications intermediaires pour les materiaux de base non renforces, recouverts ou non (prevus pour les circuits imprimes flexibles) - Film flexible polyimide a revetement adhesif)

Standard published on 10.2.1999

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 3-5: Collection de specifications intermediaires pour les materiaux de base non renforces, recouverts ou non (prevus pour les circuits imprimes flexibles) - Films a transfert de colle)

Standard published on 10.2.1999

Materials for circuit boards and other interconnecting structures - Part 3-6: Sectional specification set for unreinforced base materials clad and unclad - Polytetrafluoroethylene (PTFE) filled laminate sheets of defined flammability (vertical burning test), copper-clad
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 3-6: Specification intermediaire pour les materiaux de base non renforces, plaques et non plaques - Feuilles stratifiees en PTFE avec charges d’inflammabilite definie (essai de combustion verticale), plaquees cuivre)

Standard published on 19.5.2026

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-1: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne de type E d´inflammabilite definie)

Standard published on 30.1.2008

Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-11: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques - Tissu de verre epoxyde preimpregne de type E non halogene d´inflammabilite definie)

Standard published on 22.9.2005

Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-12: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques - Tissu de verre epoxyde preimpregne multifonctionnel de type E non halogene, d´inflammabilite definie)

Standard published on 5.9.2005