Standards IEC - International electro-technical commission - Page 1116

Fibre optic interconnecting devices and passive components - Summarising results of round robin on connector end face scratch recognition and verification by automated microscopes

Standard published on 22.11.2021

Control and protection systems for high-voltage direct current (HVDC) power transmission systems - Off-site real-time simulation testing

Standard published on 27.9.2024

Lithium-ion batteries and charging systems - Safety
(Batteries lithium-ion et systemes de charge – Securite)

Standard published on 26.4.2022

Quantification and communication of carbon footprint, GHG emission reductions and avoided emissions from electric and electronic products and systems - Principles, methodologies, requirements and guidance
(Quantification et communication de l´empreinte carbone, des reductions d´emissions de GES et des emissions evitees des produits et systems electriques et electroniques - Principes, methodologies, exigences et recommandations)

Standard published on 20.1.2026

Dynamic on-resistance test method guidelines for GaN HEMT based power conversion devices
(Lignes directrices pour les methodes d’essai de resistance dynamique a l’etat passant des dispositifs de conversion de puissance fondes sur les HEMT en GaN)

Standard published on 10.2.2022

Nuclear power plants - Instrumentation systems important to safety - Characteristics and test methods of nuclear reactor reactivity meters
(Centrales nucleaires - Systemes d´instrumentation importants pour la surete - Caracteristiques et methodes d´essai des reactimetres d´un reacteur nucleaire)

Standard published on 10.10.2025

Industrial facility energy management system (FEMS) - Functions and information flows
(Systeme de gestion d´energie des installations industrielles (FEMS) - Fonctions et flux d’informations)

Standard published on 16.8.2023

Procedures for the assessment of human exposure to electromagnetic fields from radiative wireless power transfer systems – Measurement and computational methods (frequency range of 30 MHz to 300 GHz)

Standard published on 4.11.2022

Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

Standard published on 14.12.2021

Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages

Standard published on 22.10.2024