Standards IEC - International electro-technical commission - Page 131

Mechanical standardization of semiconductor devices - Part 2: Dimensions
(Normalisation mecanique des dispositifs a semiconducteurs - Partie 2: Dimensions)

Standard published on 30.9.1999

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
(Corrigendum 1 - Normalisation mecanique des dispositifs a semiconducteurs - Partie 2: Dimensions)

Correction published on 31.1.2000

Twenty-third supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
(Vingt-troisieme complement - Normalisation mecanique des dispositifs a semiconducteurs - Partie 2: Dimensions)

Standard published on 16.6.2000

Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
(Vingt-quatrieme complement - Normalisation mecanique des dispositifs a semiconducteurs - Partie 2: Dimensions)

Standard published on 29.9.2000

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
(Normalisation mecanique des dispositifs a semiconducteurs - Partie 3: Regles generales pour la preparation des dessins d´encombrement des circuits integres)

Standard published on 29.10.1999

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
(Normalisation mecanique des dispositifs a semiconducteurs - Partie 4: Systeme de codification et classification en formes des structures des boitiers pour dispositifs a semiconducteurs)

Standard published on 10.10.2013

Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
(Amendement 1 - Normalisation mecanique des dispositifs a semiconducteurs - Partie 4: Systeme de codification et classification en formes des structures des boitiers pour dispositifs a semiconducteurs)

Change published on 27.3.2018

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
(Normalisation mecanique des dispositifs a semiconducteurs - Partie 4: Systeme de codification et classification en formes des structures des boitiers pour dispositifs a semiconducteurs)

Standard published on 27.3.2018

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
(Normalisation mecanique des dispositifs a semiconducteurs - Partie 5: Recommandations applicables aux boitiers a transfert automatise sur bande (TAB) des circuits integres)

Standard published on 23.4.1997

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

Standard published on 30.10.2001