Standards IEC - International electro-technical commission - Page 601

Transformers and inductors for use in electronic andtelecommunication equipment - Part 5: Sectional specification forpulse transformers on the basis of the capability approvalprocedure
(Transformateurs et inductances destines aux equipementselectroniques et de telecommunications - Partie 5: Specificationintermediaire pour les transformateurs d´impulsions sur la base dela procedure de l´agrement de savoir-faire)

Standard published on 6.6.1996

Transformers and inductors for use in electronic andtelecommunication equipment - Part 6: Sectional specification forinductors on the basis of the capability approval procedure
(Transformateurs et inductances destines aux equipements electroniques et de telecommunications - Partie 6: Specification intermediaire pour les inductances sur la base de la procedure de l´agrement de savoir-faire)

Standard published on 6.6.1996

Transformers and inductors for use in electronic and telecommunication equipment - Part 7: Sectional specification for high-frequency inductors and intermediate frequency transformers on the basis of the capability approval procedure
(Transformateurs et inductances destines aux equipements electroniques et de telecommunications - Partie 7: Specification intermediaire pour les inductances a haute frequence et pour les transformateurs a frequence intermediaire sur la base de la procedure de l´agrement de savoir-faire)

Standard published on 24.6.1997

Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-1: Materiaux de base renforces, plaques et non plaques - Feuilles stratifiees renforcees de papier cellulose phenolique, de qualite economique, plaquees cuivre)

Standard published on 11.1.2005

Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-10: Materiaux de base renforces, plaques et non plaques - Feuilles stratifiees renforcees en tissu de verre de type E ester de cyanate, epoxyde brome, modifie ou non, d´inflammabilite definie (essai de combustion verticale), plaquees cuivre)

Standard published on 27.2.2003

Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-11: Materiaux de base renforces, plaques et non plaques - Feuilles stratifiees renforcees en polyimide et tissu de verre de type E epoxyde brome modifie ou non modifie, d´inflammabilite definie (essai de combustion verticale), plaquees cuivre)

Standard published on 12.11.2003

Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-12: Collection de specifications intermediaires pour les materiaux de base renforces, recouverts ou non de feuille conductrice - Stratifie a base d´aramide non tisse colle avec de la resine epoxyde, recouvert de cuivre, d´inflammabilite definie)

Standard published on 29.1.1999

Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-13: Collection de specifications intermediaires pour les materiaux de base renforces, recouverts ou non de feuille conductrice - Stratifie a base d´aramide non tisse colle avec de la resine cyanate ester, recouvert de cuivre, d´inflammabilite definie)

Standard published on 26.2.1999

Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-2: Materiaux de base renforces plaques et non plaques - Feuilles stratifiees renforcees de papier cellulose phenolique, de haute qualite electrique, plaquees cuivre)

Standard published on 20.1.2005

Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-21: Materiaux de base renforces, plaques et non plaques - Feuilles stratifiees renforcees en tissu de verre de type E epoxyde non halogene, d´inflammabilite definie (essai de combustion verticale), plaquees cuivre)

Standard published on 12.11.2003