Standards IEC - International electro-technical commission - Page 606

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-17: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne non halogene de type E d´inflammabilite definie (essai de combustion verticale) destine aux assemblages sans plomb)

Standard published on 26.5.2009

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-18: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne de type E a haute performance, d´inflammabilite definie (essai de combustion verticale), pour les assemblages sans plomb)

Standard published on 4.11.2013

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-19: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne non halogene de type E a haute performance, d´inflammabilite definie (essai de combustion verticale), pour les assemblages sans plomb)

Standard published on 4.11.2013

Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability

Standard published on 5.9.2005

Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability

Standard published on 5.9.2005

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
(Materiaux pour les structures d´interconnexion - Partie 5: Collection de specifications intermediaires pour feuilles et films conducteurs avec ou sans revetement - Section 1: Feuilles de cuivre (pour la fabrication de materiaux de base plaques cuivre))

Standard published on 28.11.1995

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
(Materiaux pour les structures d´interconnexion - Partie 5: Collection de specifications intemediaires pour feuilles et films conducteurs avec ou sans revetement - Section 4: Encres conductrices)

Standard published on 18.6.1996

Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
(Materiaux pour circuits imprimes et autres structures d’interconnexion - Partie 6-3 : Ensemble de specifications intermediaires pour materiaux de renfort - Specification des tissus finis en verre "E" pour circuits imprimes)

Standard published on 14.6.2023

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper
(Materiaux pour les structures d´interconnexion - Partie 7: Collection de specifications intermediaires pour materiau a ame refrenant la dilatation - Section 1: Cuivre/invar/cuivre)

Standard published on 26.4.1995

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
(Materiaux pour les structures d´interconnexion - Partie 8: Collection des specifications intermediaires pour films nonconducteurs et revetements - Section 7: Encres de marquage)

Standard published on 26.4.1996