Standards IEC - International electro-technical commission - Page 606

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 3-4: Collection de specifications intermediaires pour les materiaux de base non renforces, recouverts ou non (prevus pour les circuits imprimes flexibles) - Film flexible polyimide a revetement adhesif)

Standard published on 10.2.1999

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 3-5: Collection de specifications intermediaires pour les materiaux de base non renforces, recouverts ou non (prevus pour les circuits imprimes flexibles) - Films a transfert de colle)

Standard published on 10.2.1999

Materials for circuit boards and other interconnecting structures - Part 3-6: Sectional specification set for unreinforced base materials clad and unclad - Polytetrafluoroethylene (PTFE) filled laminate sheets of defined flammability (vertical burning test), copper-clad

Standard published on 19.5.2026

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-1: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne de type E d´inflammabilite definie)

Standard published on 30.1.2008

Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-11: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques - Tissu de verre epoxyde preimpregne de type E non halogene d´inflammabilite definie)

Standard published on 22.9.2005

Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-12: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques - Tissu de verre epoxyde preimpregne multifonctionnel de type E non halogene, d´inflammabilite definie)

Standard published on 5.9.2005

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-14: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne de type E d´inflammabilite definie (essai de combustion verticale) destine aux assemblages sans plomb)

Standard published on 26.5.2009

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
(Materiaux pour cartes imprimees et autres structures d´interconnexion - Partie 4-15: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne multifonctionnel de type E d´inflammabilite definie (essai de combustion verticale) destine aux assemblages sans plomb)

Standard published on 26.5.2009

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
(Materiaux pour cartes imprimees et autres structures d´interconexion - Partie 4-16: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne multifonctionnel non halogene de type E d´inflammabilite definie (essai de combustion verticale) destine aux assemblages sans plomb)

Standard published on 26.5.2009

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-17: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne non halogene de type E d´inflammabilite definie (essai de combustion verticale) destine aux assemblages sans plomb)

Standard published on 26.5.2009