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Standards IEC - International electro-technical commission - Page 716
IEC – The company IEC is world-leading organization, which creates and issues International standards for all electrical, electronic and other related technologies known generally as electro-technologies. Wherever, there is electricity and electronics you can find the company IEC, which promotes the safety and performance, the environment, electrical energy efficiency and renewable energy. The company IEC also administers conformity assessment systems, which certify that the equipment, systems or components comply with International Standards of this company.
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IEC 61760-2-ed.3.0
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Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
(Technique du montage en surface - Partie 2: Conditions de transport et de stockage des composants pour montage en surface (CMS) - Guide d´application)
Standard published on 16.7.2021
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IEC 61760-2-ed.3.0-RLV
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Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
Standard published on 16.7.2021
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IEC/TR 61760-3-1-ed.1.0
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Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
Standard published on 17.6.2022
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IEC 61760-3-ed.2.0
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Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
(Technique du montage en surface - Partie 3: Methode normalisee relative a la specification des composants pour le brasage par refusion a trous traversants (THR, Through Hole Reflow))
Standard published on 3.2.2021
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IEC 61760-4-ed.1.0
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Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
(Technique du montage en surface (SMT) - Partie 4: Classification, emballage, etiquetage et manipulation des dispositifs sensibles a l´humidite)
Standard published on 19.5.2015
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IEC 61760-4-ed.1.0/Amd.1
Change
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Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
(Amendement 1 - Technique du montage en surface (SMT) - Partie 4: Classification, emballage, etiquetage et manipulation des dispositifs sensibles a l´humidite)
Change published on 13.3.2018
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IEC 61760-4-ed.1.1+Amd.1-CSV
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Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
(Technique du montage en surface (SMT) - Partie 4: Classification, emballage, etiquetage et manipulation des dispositifs sensibles a l´humidite)
Standard published on 13.3.2018
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IEC/TR 61760-5-1-ed.1.0
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Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
Standard published on 31.1.2024
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IEC 61770-ed.2.0
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Electric appliances connected to the water mains - Avoidance of backsiphonage and failure of hose-sets
(Appareils electriques raccordes au reseau d´alimentation en eau - Exigences pour eviter le retour d´eau par siphonnage et la defaillance des ensembles de raccordement)
Standard published on 23.7.2008
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IEC 61770-ed.2.0/Amd.1
Change
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Amendment 1 - Electric appliances connected to the water mains - Avoidance of backsiphonage and failure of hose-sets
(Amendement 1 - Appareils electriques raccordes au reseau d´alimentation en eau - Exigences pour eviter le retour d´eau par siphonnage et la defaillance des ensembles de raccordement)
Change published on 13.10.2015
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