IEC - International electro-technical commission - Page 818

Standards IEC - International electro-technical commission - Page 818

IEC – The company IEC is world-leading organization, which creates and issues International standards for all electrical, electronic and other related technologies known generally as electro-technologies. Wherever, there is electricity and electronics you can find the company IEC, which promotes the safety and performance, the environment, electrical energy efficiency and renewable energy. The company IEC also administers conformity assessment systems, which certify that the equipment, systems or components comply with International Standards of this company.

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IEC 62148-15-ed.3.0

Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages
(Composants et dispositifs actifs fibroniques - Normes de boitier et d´interface - Partie 15: Boitiers individuels pour laser a cavite verticale emettant par la surface)

Standard published on 30.3.2021

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235.90 USD


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IEC 62148-15-ed.3.0-RLV

Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages

Standard published on 30.3.2021

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401.80 USD


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IEC 62148-16-ed.1.0

Fibre optic active components and devices - Package and interface standards - Part 16: Transmitter and receiver components for use with LC connector interface
(Composants et dispositifs actifs a fibres optiques - Normes de boitier et d´interface - Partie 16: Composants d´emetteurs et de recepteurs destines a etre utilises avec l´interface des connecteurs LC)

Standard published on 6.8.2009

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380.50 USD


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IEC 62148-17-ed.2.0

Fibre optic active components and devices - Package and interface standards - Part 17: Transmitter and receiver components with dual coaxial RF connectors
(Composants et dispositifs actifs fibroniques - Normes de boitiers et d’interface - Partie 17: Composants emetteurs et recepteurs avec deux connecteurs RF coaxiaux)

Standard published on 20.9.2023

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121.80 USD


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IEC 62148-18-ed.1.0

Fiber optic active components and devices - Package and interface standards - Part 18: 40-Gbit/s serial transmitter and receiver components for use with the LC connector interface
(Composants et dispositifs actifs fibroniques - Normes de boitier et d´interface - Partie 18: Composants emetteurs et recepteurs serie a 40 Gbit/s a utiliser avec l’interface de connecteur LC)

Standard published on 25.11.2014

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380.50 USD


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IEC 62148-19-ed.1.0

Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package
(Composants et dispositifs actifs fibroniques - Normes de boitier et d’interface - Partie 19 : Boitier a puce photonique)

Standard published on 2.5.2019

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380.50 USD


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IEC 62148-2-ed.2.0

Fibre optic active components and devices - Package and interface standards - Part 2: SFF 10-pin transceivers
(Composants et dispositifs actifs en fibres optiques - Normes de boitier et d´interface - Partie 2: Emetteurs-recepteurs SFF a 10 broches)

Standard published on 15.12.2010

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121.80 USD


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IEC 62148-2-ed.2.0/Amd.1 Change

Amendment 1 - Fibre optic active components and devices - Package and interface standards - Part 2: SFF 10-pin transceivers
(Amendement 1 - Composants et dispositifs actifs en fibres optiques - Normes de boitier et d´interface - Partie 2: Emetteurs-recepteurs SFF a 10 broches)

Change published on 19.11.2024

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15.20 USD


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IEC 62148-2-ed.2.1+Amd.1-CSV

Fibre optic active components and devices - Package and interface standards - Part 2: SFF 10-pin transceivers

Standard published on 19.11.2024

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235.90 USD


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IEC 62148-21-ed.2.0

Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
(Composants et dispositifs actifs fibroniques - Normes de boitier de d´interface - Partie 21: Lignes directrices en matiere de conception de l’interface electrique des boitiers PIC utilisant des boitiers matriciels a billes et a pas fins en silicium (S-FBGA) et des boitiers matriciels a zone de contact plate et a pas fins en silicium (S-FLGA))

Standard published on 22.4.2021

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121.80 USD


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Entries shown from 8170 to 8180 out of a total of 11295 entries.


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