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IEC – The company IEC is world-leading organization, which creates and issues International standards for all electrical, electronic and other related technologies known generally as electro-technologies. Wherever, there is electricity and electronics you can find the company IEC, which promotes the safety and performance, the environment, electrical energy efficiency and renewable energy. The company IEC also administers conformity assessment systems, which certify that the equipment, systems or components comply with International Standards of this company.
Fiber optic active components and devices - Package and interface standards - Part 18: 40-Gbit/s serial transmitter and receiver components for use with the LC connector interface
(Composants et dispositifs actifs fibroniques - Normes de boitier et d´interface - Partie 18: Composants emetteurs et recepteurs serie a 40 Gbit/s a utiliser avec l’interface de connecteur LC)
Standard published on 25.11.2014
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Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package
(Composants et dispositifs actifs fibroniques - Normes de boitier et d’interface - Partie 19 : Boitier a puce photonique)
Standard published on 2.5.2019
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Fibre optic active components and devices - Package and interface standards - Part 2: SFF 10-pin transceivers
(Composants et dispositifs actifs en fibres optiques - Normes de boitier et d´interface - Partie 2: Emetteurs-recepteurs SFF a 10 broches)
Standard published on 15.12.2010
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Amendment 1 - Fibre optic active components and devices - Package and interface standards - Part 2: SFF 10-pin transceivers
(Amendement 1 - Composants et dispositifs actifs en fibres optiques - Normes de boitier et d´interface - Partie 2: Emetteurs-recepteurs SFF a 10 broches)
Change published on 19.11.2024
Selected format:Fibre optic active components and devices - Package and interface standards - Part 2: SFF 10-pin transceivers
Standard published on 19.11.2024
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Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
(Composants et dispositifs actifs fibroniques - Normes de boitier de d´interface - Partie 21: Lignes directrices en matiere de conception de l’interface electrique des boitiers PIC utilisant des boitiers matriciels a billes et a pas fins en silicium (S-FBGA) et des boitiers matriciels a zone de contact plate et a pas fins en silicium (S-FLGA))
Standard published on 22.4.2021
Selected format:Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
Standard published on 22.4.2021
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Fibre optic active components and devices - Package and interface standards - Part 22: 25 Gbit/s directly modulated laser packages with temperature control unit
(Composants et dispositifs actifs fibroniques - Normes de boitier et d´interface - Partie 22: Boitiers pour laser a modulation 25 Gbit/s equipes d´une unite de regulation de temperature)
Standard published on 15.2.2023
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Fibre optic active components and devices - Package and interface standards - Part 3: SFF 20-pin transceivers
(Composants et dispositifs actifs en fibres optiques - Normes de boitier et d´interface - Partie 3: Emetteurs-recepteurs SFF a 20 broches)
Standard published on 25.11.2010
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Fibre optic active components and devices - Package and interface standards - Part 5: SC 1x9 fibre optic modules
(Composants et dispositifs actifs en fibres optiques - Normes de boitier et d´interface - Partie 5 : Modules a fibres optiques SC 1x9)
Standard published on 10.2.2003
Selected format:Latest update: 2026-03-27 (Number of items: 2 269 573)
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