Standards IEC - International electro-technical commission - Page 924

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics

Standard published on 26.7.2013

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines

Standard published on 25.9.2013

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies

Standard published on 7.10.2013

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes

Standard published on 25.2.2014

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling

Standard published on 10.4.2018

Graphical symbols for use on equipment - Guidelines for the inclusion of graphical symbols in IEC publications

Standard published on 27.9.2022

Graphical symbols for use on equipment - Guidelines for the inclusion of graphical symbols in IEC publications

Standard published on 27.9.2022

Requirements for measurement standards for high intensity therapeutic ultrasound (HITU) devices

Standard published on 28.4.2010

Nuclear power plants - Instrumentation important to safety - Thermocouples: characteristics and test methods
(Centrales nucleaires de puissance - Instrumentation importante pour la surete - Thermocouples: caracteristiques et methodes d´essai)

Standard published on 29.4.2013

Effects of engaging and separating under electrical load on connector interfaces in cabling used to support IEEE 802.3af (power-over-ethernet) applications

Standard published on 30.3.2010