Standards JIS - Japanese technical standards - Page 352

Environmental testing -- Part 2-83: Tests -- Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Standard published on 22.9.2014

Environmental testing -- Part 2-85: Tests -- Test Fj: Vibration -- Long time history replication

Standard published on 23.9.2020

Environmental testing -- Part 3-1: Supporting documentation and guidance -- Cold and dry heat tests

Standard published on 20.4.2016

Environmental testing -- Part 3-13: Supporting documentation and guidance on Test T -- Soldering

Standard published on 20.2.2018

Basic environmental testing procedures Part 3: Background information Section Two -- Combined temperature/low air pressure tests

Standard published on 20.3.2004

Environmental testing -- Part 3-3: Supporting documentation and guidance -- Seismic test methods for equipment (Amendment 1)

Change published on 21.8.2023

Environmental testing -- Part 3-3: Supporting documentation and guidance -- Seismic test methods for equipment

Standard published on 21.9.2021

Environmental testing-Part 3-4: Supporting documentation and guidance-Damp heat tests

Standard published on 20.8.2025

Environmental testing -- Part 3-5: Supporting documentation and guidance -- Confirmation of the performance of temperature chambers

Standard published on 23.9.2020

Environmental testing -- Part 3-6: Supporting documentation and guidance -- Confirmation of the performance of temperature/humidity chambers

Standard published on 23.9.2020