BASE MATERIALS FOR PRINTED CIRCUITS. TEST METHODS.

WITHDRAWN published on 16.9.1993

METAL-CLAD BASE MATERIALS FOR PRINTED CIRCUITS. SPECIFICATIONS

WITHDRAWN published on 15.4.1980

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATIION. NO. 1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.

WITHDRAWN published on 29.12.1993

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION No 10: EPOXIDE NON-WOVEN/WOVEN GLASS REINFORCED COPPER-CLAD LAMINATED SHEET, OF DEFINED FALMMABILITY (VERTICAL BURNING TEST).

WITHDRAWN published on 29.12.1993

METAL-CLAD BASE MATERIALS FOR PRINTED CIRCUITS. SPECIFICATIONS

WITHDRAWN published on 15.12.1980

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION No 11: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.

WITHDRAWN published on 29.12.1993

METAL-CLAD BASE MATERIALS FOR PRINTED. SPECIFICATIONS

WITHDRAWN published on 15.3.1981

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION No 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPE-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.

WITHDRAWN published on 29.12.1993

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION No 13: FLEXIBLE COPPER-CLAD POLYMIDA FILM, GENERAL PURPOSE GRADE.

WITHDRAWN published on 29.12.1993

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION No 14: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), ECONOMIC QUALITY.

WITHDRAWN published on 29.12.1993