Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

WITHDRAWN published on 28.2.2021

Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages.

WITHDRAWN published on 23.1.2001

Mechanical standardization of semiconductor devices -- Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

WITHDRAWN published on 26.3.2004

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

WITHDRAWN published on 2.11.2019

Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (Endorsed by AENOR in March of 2005.)

WITHDRAWN published on 1.12.2012

LOW PRESSURE SODIUM VAPOUR LAMPS.

WITHDRAWN published on 11.9.1996

Hydraulic turbines, storage pumps and pump-turbines - Model acceptance tests.

WITHDRAWN published on 25.9.2002

ALUMINIUM AND ALUMINIUM ALLOYS. WROUGHT PRODUCTS. CHEMICAL COMPOSITION OF SEMI PRODUCTS USED FOR THE FABRICATION OF ARTICLES FOR USE IN CONTACT WITH FOOD.

WITHDRAWN published on 26.12.1995

SAFETY OF MACHINERY. ELECTRICAL EQUIPMENT OF MACHINES. PART 1: GENERAL REQUIREMENTS.

WITHDRAWN published on 18.5.1995

SAFETY OF MACHINERY. ELECTRICAL EQUIPMENT OF MACHINES. PART 1: GENERAL REQUIREMENTS.

WITHDRAWN published on 25.2.1999