MAGNETIC OXIDE CORES (ETD-CORES) INTENDED FOR USE IN POWER SUPPLY APPLICATIONS. DIMENSIONS. (Endorsed by AENOR in November of 1997.)

WITHDRAWN published on 1.6.2008

Ferrite cores (ETD-cores) intended for use in power supply applications - Dimensions (Endorsed by AENOR in September of 2005.)

WITHDRAWN published on 9.1.2019

ELECTRICAL AND ELECTRONIC MEASURING EQUIPMENT. DOCUMENTATION.

WITHDRAWN published on 21.5.1996

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

WITHDRAWN published on 31.3.2024

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

WITHDRAWN published on 16.5.2020

TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES. PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES (Endorsed by AENOR in November of 1997.)

WITHDRAWN published on 1.9.2009

TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES. PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) (Endorsed by AENOR in November of 1997.)

WITHDRAWN published on 1.12.2010

Attachment materials for electronic assembly -- Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly (Endorsed by AENOR in November of 2002.)

WITHDRAWN published on 1.5.2010

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

WITHDRAWN published on 27.3.2017

Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2002). (Endorsed by AENOR in November of 2002.)

WITHDRAWN published on 1.5.2010