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ASTM B490-92(1998)
Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits
STANDARD published on 10.11.1998
The information about the standard:
Designation standards: ASTM B490-92(1998)
Note: WITHDRAWN
Publication date standards: 10.11.1998
SKU: NS-6891
The number of pages: 2
Approximate weight : 6 g (0.01 lbs)
Country: American technical standard
Category: Technical standards ASTM
Annotation of standard text ASTM B490-92(1998) :
Keywords:
Bend testing-coatings, electrodeposited foils-ductility, by micrometer bend method, practice,, Ductility, ductility of electrodeposits, micrometer test,, Electrodeposited coatings, ductility, of electrodeposited foils, by micrometer bend test,, practice,, Foil, electrodeposited, ductility by micrometer bend test, practice,, Micrometer bend test, ductility of electrodeposited foils, practice, ICS Number Code 17.040.20 (Properties of surfaces), 25.220.40 (Metallic coatings)
Additional information
| 1. Scope | ||
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1.1 This practice describes a procedure for measuring the ductility of electrodeposited foils. 1.2 This practice is suitable only for the evaluation of electrodeposits having low ductility. 1.3 The obtained ductility values must only be considered semi-quantitative because this test has a significant operator dependence. 1.4 This practice is best used for in-house process control where measurements are always made by the same operator. A change in ductility value can be used as an indication of possible changes in the electroplating solution. 1.5 This standard does not purport to address the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. |
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| 2. Referenced Documents | ||
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