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ASTM B907-16(2021)
Standard Specification for Zinc, Tin and Cadmium Base Alloys Used as Solders
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STANDARD published on 1.11.2021
The information about the standard:
Designation standards: ASTM B907-16(2021)
Publication date standards: 1.11.2021
SKU: NS-1044294
The number of pages: 6
Approximate weight : 18 g (0.04 lbs)
Country: American technical standard
Category: Technical standards ASTM
The category - similar standards:
Annotation of standard text ASTM B907-16(2021) :
This specification covers solder metal alloys used as solders for the purpose of joining together two or more metals at temperatures below their melting points. The solder alloy shall conform to the required chemical compositions of cadmium, zinc, tin, lead, antimony, silver, copper, aluminum, bismuth, arsenic, iron, nickel and magnesium. The solder paste shall conform to the required smoothness of textures, powder mesh size, and viscosity.
Keywords:
bar, cadmium-silver alloys, cadmium-zinc alloys, cadmium-zinc-silver alloys, ingot, powder, ribbon, solder alloy, solder metal, solder uses, tin-cadmium-zinc alloys, tin-zinc alloys, wire, zinc-aluminum alloys, zinc-aluminum-copper alloys, zinc-cadmium alloys, zinc-tin alloys, zinc-tin-copper alloys,, ICS Number Code 77.120.60 (Lead, zinc, tin and their alloys)
Additional information
| 1. Scope | ||||||||||||||||||||||||||||||||
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1.1?This specification covers solder metal alloys (commonly known as soft solders), including zinc-aluminum, zinc-aluminum-copper, zinc-tin, zinc-tin-copper, zinc-cadmium-tin, zinc-cadmium, tin-zinc, cadmium-zinc, cadmium-zinc-silver, and cadmium-silver, used as solders for the purpose of joining together two or more metals at temperatures below their melting points. 1.1.1?Certain alloys specified in this standard are also used as Thermal Spray Wire in the electronics industry and are covered for this purpose in Specification B943. Specification B833 covers Zinc and Zinc Alloy Wire for Thermal Spraying (Metallizing) used primarily for the corrosion protection of steel (as noted in Annex A1 of this specification). 1.1.2?Tin base alloys are included in this specification because their use in the electronics industry is different than the major use of the tin and lead solder compositions specified in Specification B32. 1.1.3?These solders include alloys having a nominal liquidus temperature not exceeding 850?F (455?C). 1.1.4?This specification includes solder in the form of solid bars, ingots, wire, powder and special forms, and in the form of solder paste. 1.2?The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard. 1.3?Toxicity1.4?This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar with all hazards including those identified in the appropriate Safety Data Sheet (SDS) for this product/material as provided by the manufacturer, to establish appropriate safety, health, and environmental practices, and determine the applicability of regulatory limitations prior to use. 1.5?This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee. |
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| 2. Referenced Documents | ||||||||||||||||||||||||||||||||
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