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Standard Test Methods for Glass-Bonded Mica Used as Electrical Insulation
STANDARD published on 1.5.2010
Designation standards: ASTM D1039-94(2010)
Note: WITHDRAWN
Publication date standards: 1.5.2010
SKU: NS-16124
The number of pages: 7
Approximate weight : 21 g (0.05 lbs)
Country: American technical standard
Category: Technical standards ASTM
Keywords:
arc resistance, compressive strength, dielectric strength, dilatometry, dissipation factor, glass-bonded mica, heat distortion, impact resistance, interferometry, linear thermal expansion, mica, modulus of rupture, permittivity, porosity, resistivity, Rockwell hardness, specific gravity, synthetic mica, tensile strength, thermal conductivity, Ceramic electrical/electronic devices/applications, Glass electrical/electronic insulation, Heating tests--electrical insulating materials, Mica
| Significance and Use | ||||||||||||||||||||||||||||||||||||||||||||||
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This characteristic is useful for specification purposes and has utility as a quality control parameter. |
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| 1. Scope | ||||||||||||||||||||||||||||||||||||||||||||||
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1.1 These test methods cover the evaluation of the characteristics of glass-bonded, natural, or synthetic mica materials intended for use as electrical insulation. 1.2 Glass bonded mica materials are commercially available in both injection molded and compression molded types. These test methods are applicable to both types except for tensile strength methods. (See Section 41.) |
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| 2. Referenced Documents | ||||||||||||||||||||||||||||||||||||||||||||||
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