ASTM D1867-13

Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring (Withdrawn 2020)

Automatically translated name:

Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

STANDARD published on 1.11.2013

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The information about the standard:

Designation standards: ASTM D1867-13
Note: WITHDRAWN
Publication date standards: 1.11.2013
SKU: NS-18607
The number of pages: 5
Approximate weight : 15 g (0.03 lbs)
Country: American technical standard
Category: Technical standards ASTM

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The category - similar standards:

Printed circuits and boards

Annotation of standard text ASTM D1867-13 :

Keywords:
circuit board, copper-clad laminate, printed circuit board, printed wiring board, thermosetting laminate, ICS Number Code 31.180 (Printed circuits and boards)

Additional information

1. Scope

1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

2. Referenced Documents

D709-17	Standard Specification for Laminated Thermosetting Materials
D3636-19	Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials
NEMA Publication Number LI-1 Available from National Electrical Manufacturers Association, 2101 L St., N.W., Washington, DC 20037.
MIL-P-13949	Plastic Sheet, Laminated, Metal Clad (for Printed Wiring Boards) Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700 Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS.
D5109-12	Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)
D1711-24	Standard Terminology Relating to Electrical Insulation

Similar standards:

ASTM B885-09

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15.4.2009

ASTM D3380-10

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1.1.2010

ASTM D5109-12

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1.11.2012

ASTM F1896-10

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1.5.2010

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