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ASTM D5213-04
Standard Specification for Polymeric Resin Film for Electrical Insulation and Dielectric Applications
STANDARD published on 1.5.2004
The information about the standard:
Designation standards: ASTM D5213-04
Note: WITHDRAWN
Publication date standards: 1.5.2004
SKU: NS-30305
The number of pages: 6
Approximate weight : 18 g (0.04 lbs)
Country: American technical standard
Category: Technical standards ASTM
Annotation of standard text ASTM D5213-04 :
Keywords:
conditioning, dielectric strength, dissipation factor, elongation, FEP fluorocarbon, film, fluorinated poly(ethylene-propylene), heat-seal strength, heatsealable, permittivity, polyethylene naphthalate, polyethylene terephthalate, polyimide, poly(N, N`-p, p`-oxydiphenylene biphenyltetracarboxylimide), poly(N, N`-p, p`oxydiphenylene pyromellitimide), poly(N, N`-p-phenylene biphenyltetra-carboxylimide), shrinkage, tensile strength, thickness, volume resistivity
Additional information
| 1. Scope | ||||||||||||||
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1.1 This specification covers requirements for the material, dimensions and tolerances, and property values of film, in sheet or strip form, with or without heat-sealable coatings. 1.2 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only. Note 1—This document is similar to IEC 60674, Part 3, Sheets 2, 4, 5, 6, and 7. |
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| 2. Referenced Documents | ||||||||||||||
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