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ASTM E1237-93(2003)
Standard Guide for Installing Bonded Resistance Strain Gages
STANDARD published on 10.4.1998
The information about the standard:
Designation standards: ASTM E1237-93(2003)
Note: WITHDRAWN
Publication date standards: 10.4.1998
SKU: NS-40970
The number of pages: 4
Approximate weight : 12 g (0.03 lbs)
Country: American technical standard
Category: Technical standards ASTM
Annotation of standard text ASTM E1237-93(2003) :
Keywords:
Adhesion, Adhesive bonding, Base-metal substrates, Bonded resistance strain gages, Bonding, Bond strength, Electrical measurements, Environmental control/fate, Etched foil resistance strain gages, Expansion, Heating tests-metals, Installation, Resistance, Resistance gages, Solder/soldering applications, Strain gages, Strain testing-metallic materials, Stress-metallic materials, Thermal coefficient of expansion, Verification, installing bonded resistance strain gages, guide
Additional information
| 1. Scope | ||||
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1.1 This document provides guidelines for installing bonded resistance strain gages. It is not intended to be used for bulk or diffused semiconductor gages. This document pertains only to adhesively bonded strain gages. 1.2 This standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. |
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| 2. Referenced Documents | ||||
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