ASTM E1555-20

Standard Specification for Structural Paste Adhesive for Sandwich Panel Repair

Translate name

STANDARD published on 1.9.2020


Language
Format
AvailabilityIN STOCK
Price52.00 USD excl. VAT
52.00 USD

The information about the standard:

Designation standards: ASTM E1555-20
Publication date standards: 1.9.2020
SKU: NS-1006785
The number of pages: 5
Approximate weight : 15 g (0.03 lbs)
Country: American technical standard
Category: Technical standards ASTM

The category - similar standards:

Adhesives

Annotation of standard text ASTM E1555-20 :

This specification defines those characteristics that are required of adhesives to be used in the repair of sandwich panels for durable, rigid wall, relocatable structures. It covers two-part epoxy adhesive suitable for bonding aluminum alloy facings to nonmetallic core and core to core in the repair of durable rigid wall, relocatable structures. The adhesive shall be suitable for forming bonds that will withstand exposure to a certain temperature range and high relative humidity and will also withstand the combinations of stress, temperature, and relative humidity that are expected to be encountered in service. The adhesive shall also be suitable for the bonding of panel inserts and edge attachments. The adhesive physical characteristics such as adhesive life, curing, mix ratio, storage life, and mechanical properties shall be observed in order to determine its working characteristics. The following tests shall be conducted to determine certain mechanical properties: tensile lap shear test, flatwise tension test, climbing drum peel test, and durability test.


Keywords:
adhesive, epoxy, paste, properties, repair, sandwich, structure,, ICS Number Code 83.180 (Adhesives)

We recommend:

Technical standards updating

Do you want to make sure you use only the valid technical standards?
We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.

Would you like to know more? Look at this page.


This website uses cookie files. By browsing this website you expresses your consent with using cookies. More information / I understand