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ASTM F1211-89(1994)e1
Standard Specification for Semiconductor Device Passivation Opening Layouts (Includes all amendments And changes 8/16/2017).
Automatically translated name:
Standard Specification for Semiconductor Device Passivation Opening Layouts
STANDARD published on 1.1.2001
The information about the standard:
Designation standards: ASTM F1211-89(1994)e1
Note: WITHDRAWN
Publication date standards: 1.1.2001
SKU: NS-49516
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Category: Technical standards ASTM
Annotation of standard text ASTM F1211-89(1994)e1 :
Keywords:
opening layouts, passivation, semiconductor devices
Additional information
| 1. Scope |
|
1.1 This specification covers standard semiconductor device passivation opening layouts for various tape automated bonding interconnection technologies. 1.2 This specification establishes the nominal passivation opening dimensions, nominal passivation, opening spacing, nominal corner passivation opening offset, minimum scribe guard and minimum die size for the most common input/ output counts within each technology. 1.3 This specification is extendable to other interconnection technologies if the passivation opening and spacing are adjusted in such a way that the progression is not modified. 1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only. |
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