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  4. Standard "ASTM F1211-89(2001)"
WITHDRAWN ASTM F1211-89(2001) 1.1.2001 preview

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ASTM F1211-89(2001)

Standard Specification for Semiconductor Device Passivation Opening Layouts (Withdrawn 2007)



STANDARD published on 1.1.2001


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The information about the standard:

Designation standards: ASTM F1211-89(2001)
Note: WITHDRAWN
Publication date standards: 1.1.2001
SKU: NS-49517
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Category: Technical standards ASTM

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Annotation of standard text ASTM F1211-89(2001) :

Keywords:

opening layouts, passivation, semiconductor devices, ICS Number Code 31.080.01 (Semi-conductor devices in general)

Additional information

 
1. Scope

1.1 This specification covers standard semiconductor device passivation opening layouts for various tape automated bonding interconnection technologies.

1.2 This specification establishes the nominal passivation opening dimensions, nominal passivation, opening spacing, nominal corner passivation opening offset, minimum scribe guard and minimum die size for the most common input/ output counts within each technology.

1.3 This specification is extendable to other interconnection technologies if the passivation opening and spacing are adjusted in such a way that the progression is not modified.

1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.
 

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