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ASTM F1238-95(1999)
Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
STANDARD published on 10.12.1999
The information about the standard:
Designation standards: ASTM F1238-95(1999)
Note: WITHDRAWN
Publication date standards: 10.12.1999
SKU: NS-49599
The number of pages: 2
Approximate weight : 6 g (0.01 lbs)
Country: American technical standard
Category: Technical standards ASTM
Annotation of standard text ASTM F1238-95(1999) :
Keywords:
density, microelectronics, molybdenum, disilicide, refractory silicides, sputtering, sputtering targets, tantalum disilicide, titanium disilicide, tungsten disilicide, ICS Number Code 31.100 (Electronic tubes)
Additional information
| 1. Scope |
|
1.1 This specification covers sputtering targets fabricated from metallic silicides (molybdenum silicide, tantalum silicide, titanium silicide, and tungsten silicide). These targets are referred to as refractory silicide targets, and are intended for use in microelectronic applications. 1.2 The values stated in SI units are regarded as standard. |
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