We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Standard Guide for Application of Certified Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon (Withdrawn 2003)
STANDARD published on 10.7.2002
Designation standards: ASTM F1527-02
Note: WITHDRAWN
Publication date standards: 10.7.2002
SKU: NS-50637
The number of pages: 15
Approximate weight : 45 g (0.10 lbs)
Country: American technical standard
Category: Technical standards ASTM
Keywords:
certified reference materials, control chart, eddy current gage, four-point probe method, mercury probe, reference materials, resistivity, resistivity reference wafer, semiconductor, sheet resistance, silicon wafers, SPC, spreading resistance probe, Standard Reference Materials, ICS Number Code 29.045 (Semiconducting materials)
1. Scope |
This standard was transferred to SEMI (www.semi.org) May 2003 1.1 This guide covers the application of Certified Reference Materials (CRMs) for resistivity measurements on silicon wafers. Specifically, this guide covers the use of these CRMs for preparing resistivity reference wafers and for ensuring the quality of the instrumentation used for preparing them. 1.2 This guide has not been evaluated for application to electronic materials other than silicon. 1.3 The guide covers the selection of materials for resistivity reference wafers, procedures for preparing and calibrating resistivity reference wafers, and use of resistivity reference wafers in qualifying, calibrating, and controlling various types of resistivity instrumentation. 1.4 The guide provides criteria for selection of instruments for determining the resistivity of silicon resistivity reference materials, procedures for maintaining such instruments in statistical quality control, and training requirements for operators engaged in making and using resistivity reference wafers. 1.5 Appendixes are included that cover ( 1) suggested control charting procedures for organizations that do not already have such procedures in place, and (2) errors in resistivity determination that result from uncertainties in wafer diameter, wafer thickness, and probe-tip spacing. 1.6 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. |
Latest update: 2025-07-09 (Number of items: 2 207 504)
© Copyright 2025 NORMSERVIS s.r.o.