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ASTM F1893-98
Guide for Measurement of Ionizing Dose-Rate Burnout of Semiconductor Devices
STANDARD published on 10.5.1998
The information about the standard:
Designation standards: ASTM F1893-98
Note: WITHDRAWN
Publication date standards: 10.5.1998
SKU: NS-51996
The number of pages: 5
Approximate weight : 15 g (0.03 lbs)
Country: American technical standard
Category: Technical standards ASTM
Annotation of standard text ASTM F1893-98 :
Keywords:
burnout, failure, high dose-rate, integrated circuits, ionizing radiation, latchup, microcircuits, semiconductor devices, survivability, ICS Number Code 31.080.01 (Semi-conductor devices in general)
Additional information
| 1. Scope | ||||||||||
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1.1 This guide defines the detailed requirements for testing microcircuits for short pulse high dose-rate ionization-induced failure. Large flash x-ray (FXR) machines operated in the photon mode, or FXR e-beam facilities are required because of the high dose-rate levels that are necessary to cause burnout. Two modes of test are possible (1) survival test, and (2) A failure level test. 1.2 The values stated in International System of Units (SI) are to be regarded as standard. No other units of measurement are included in this standard. |
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| 2. Referenced Documents | ||||||||||
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