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Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications
STANDARD published on 1.6.2007
    
        Designation standards: ASTM F2113-01(2007)
                
                
                
                Note:    WITHDRAWN
               
                Publication date standards:  1.6.2007
                  SKU:  NS-52870
          The number of pages: 2
Approximate weight : 6 g (0.01 lbs)
        Country:          American technical standard
        Category: Technical standards ASTM
        
                
              
Keywords:
electronics, purity analysis, purity grade, sputtering, target, thin film, ICS Number Code 29.045 (Semiconducting materials)
| 1. Scope | ||
| 1.1 This guide covers sputtering targets used as thin film source material in fabricating semiconductor electronic devices. It should be used to develop target specifications for specific materials and should be referenced therein. 1.2 This standard sets purity grade levels, analytical methods and impurity content reporting method and format. 1.2.1 The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance. | ||
| 2. Referenced Documents | ||
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