ASTM F3192-16

Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization (Withdrawn 2023)

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STANDARD published on 1.9.2016


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The information about the standard:

Designation standards: ASTM F3192-16
Note: WITHDRAWN
Publication date standards: 1.9.2016
SKU: NS-666127
The number of pages: 5
Approximate weight : 15 g (0.03 lbs)
Country: American technical standard
Category: Technical standards ASTM

The category - similar standards:

Metallic coatings

Annotation of standard text ASTM F3192-16 :

Keywords:
high-purity copper, sputtering target, TSV metallization,, ICS Number Code 25.220.40 (Metallic coatings)

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