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ASTM F357-78(1997)e1
Standard Practice for Determining Solderability of Thick Film Conductors (Includes all amendments And changes 3/2/2021).
Automatically translated name:
Standard Practice for Determining Solderability of Thick Film Conductors
STANDARD published on 1.1.1991
The information about the standard:
Designation standards: ASTM F357-78(1997)e1
Note: WITHDRAWN
Publication date standards: 1.1.1991
SKU: NS-55037
The number of pages: 2
Approximate weight : 6 g (0.01 lbs)
Country: American technical standard
Category: Technical standards ASTM
Annotation of standard text ASTM F357-78(1997)e1 :
Keywords:
hybrid microcircuits, solderability, solder wetting, thick-film metallization
Additional information
| 1. Scope |
|
1.1 This practice covers a procedure for determining the solderability of thick-film conductors. The procedure has been adapted from several techniques that are in routine use for testing this property. 1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only. 1.3 This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of whoever uses this standard to consult and establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. |
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