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ASTM F508-77(2002)
Standard Practice for Specifying Thick-Film Pastes (Withdrawn 2008)
STANDARD published on 10.12.2002
The information about the standard:
Designation standards: ASTM F508-77(2002)
Note: WITHDRAWN
Publication date standards: 10.12.2002
SKU: NS-55567
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Category: Technical standards ASTM
Annotation of standard text ASTM F508-77(2002) :
Keywords:
hybrid microcircuits, reliability, solderability, thick films, ICS Number Code 31.260 (Optoelectronics. Laser equipment)
Additional information
| 1. Scope |
|
1.1 This practice covers the writing of specifications for thick-film pastes for electronics. 1.2 The practice provides a guide for the routine procedure to be followed in specifying for procurement thick-film pastes for use in manufactured circuits. Specific requirements, intended applications, and test methods should be included or identified in each paste specification. In addition, each specification should include basic information to facilitate procurement, preparation, quality control, lot shipment identifications, and shipping of such pastes. 1.3 The practice covers the development of specifications for fireable, thick-film pastes, including resistor, conductor, dielectric, and overglaze pastes. |
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