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ASTM F542-98
Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
STANDARD published on 10.10.1998
The information about the standard:
Designation standards: ASTM F542-98
Note: WITHDRAWN
Publication date standards: 10.10.1998
SKU: NS-55657
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Category: Technical standards ASTM
Annotation of standard text ASTM F542-98 :
Keywords:
electronic, encapsulating compounds, exothermic temperature, microelectronic encapsulation, ICS Number Code 31.240 (Mechanical structures for electronic equipment)
Additional information
| 1. Scope | ||||
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1.1 This test method covers a means for measuring the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached. 1.2 This test method measures the potential heat output of an encapsulating compound under conditions that provide no significant heat sink. 1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 6. |
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| 2. Referenced Documents | ||||
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