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Guide for Selection of Tests for Material Properties of Transfer Molding Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 1996)
Designation standards: ASTM F636-85(1991)
Note: WITHDRAWN
SKU: NS-55972
The number of pages: 4
Approximate weight : 12 g (0.03 lbs)
Country: American technical standard
Category: Technical standards ASTM
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Latest update: 2025-07-11 (Number of items: 2 208 012)
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