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ASTM F692-97
Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates
STANDARD published on 1.1.1991
The information about the standard:
Designation standards: ASTM F692-97
Note: WITHDRAWN
Publication date standards: 1.1.1991
SKU: NS-56137
The number of pages: 6
Approximate weight : 18 g (0.04 lbs)
Country: American technical standard
Category: Technical standards ASTM
Annotation of standard text ASTM F692-97 :
Keywords:
adhesion strength, metallization, solderable thick film
Additional information
| 1. Scope |
|
1.1 This test method covers the determination of the adhesion strength of films to substrates by pulling wires soldered to the films. 1.2 This test method is intended to measure the adhesion of metallization to substrates, and not the strength of the solder. 1.3 This test method applies to all films that can be soldered. 1.4 The maximum melting point of solder used with this test method is determined by the characteristics of the solder flux. 1.5 This test method is destructive. 1.6 This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of whoever uses this standard to consult and establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. |
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