Cookies
We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
ASTM F72-24
Standard Specification for Gold Wire for Semiconductor Lead Bonding
Translate name
STANDARD published on 1.4.2024
The information about the standard:
Designation standards: ASTM F72-24
Publication date standards: 1.4.2024
SKU: NS-1180753
The number of pages: 11
Approximate weight : 33 g (0.07 lbs)
Country: American technical standard
Category: Technical standards ASTM
Annotation of standard text ASTM F72-24 :
This specification covers round drawn/extruded gold wires for internal semiconductor device electrical connections. The wires are available in four classifications, namely: copper-modified wire, beryllium-modified wire, high-strength wire, and special purpose wire. Aptly sampled wires shall be examined by test methods suggested herein, and each class shall conform correspondingly to specified requirements for chemical composition, mechanical properties (breaking load and elongation), dimension (diameter and weight), and workmanship and finish. The wires shall also undergo wire curl, wire axial twist, and wire roundness tests.
We recommend:
Technical standards updating
Do you want to make sure you use only the valid technical standards?
We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.
Would you like to know more? Look at this page.
