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Method for scale adhesion test for oxygen-free copper.
STANDARD published on 30.4.1980
Designation standards: BS 5909:1980
Publication date standards: 30.4.1980
SKU: NS-72421
The number of pages: 6
Approximate weight : 18 g (0.04 lbs)
Country: British technical standard
Category: Technical standards BS
Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide. Status: Under Review
WITHDRAWN
31.1.1979
WITHDRAWN
30.9.1982
30.9.1982
WITHDRAWN
15.11.1999
WITHDRAWN
31.1.2013
28.9.1984
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