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Standard BS EN IEC 60749-22-1:2026 21.1.2026 preview

BS EN IEC 60749-22-1:2026

Semiconductor devices — Mechanical and climatic test methods. Bond strength — wire bond pull test methods.

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STANDARD published on 21.1.2026


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The information about the standard:

Designation standards: BS EN IEC 60749-22-1:2026
Publication date standards: 21.1.2026
SKU: NS-1256146
The number of pages: 68
Approximate weight : 204 g (0.45 lbs)
Country: British technical standard
Category: Technical standards BS

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Semiconductor devices in generalMagnetic components

Annotation of standard text BS EN IEC 60749-22-1:2026 :

ISBN: 978 0 539 34038 9 Status: Definitive

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