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Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Decomposition temperature (Td) using TGA.
Translate name
STANDARD published on 5.11.2021
Designation standards: BS EN IEC 61189-2-807:2021
Publication date standards: 5.11.2021
SKU: NS-1041678
The number of pages: 14
Approximate weight : 42 g (0.09 lbs)
Country: British technical standard
Category: Technical standards BS
Printed circuits and boardsOpen systems interconnection in general
ISBN: 978 0 539 12605 1 Status: Definitive
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