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Thermal standardization on semiconductor packages. Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points.
Translate name
STANDARD published on 24.3.2026
Designation standards: BS EN IEC 63378-6:2026
Publication date standards: 24.3.2026
SKU: NS-1265180
The number of pages: 34
Approximate weight : 102 g (0.22 lbs)
Country: British technical standard
Category: Technical standards BS
ISBN: 978 0 539 31677 3 Status: Definitive
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Latest update: 2026-11-04 (Number of items: 2 209 068)
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