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Semiconductor devices. Micro-electromechanical devices. Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT).
Translate name
STANDARD published on 22.7.2020
Designation standards: BS IEC 62047-27:2017
Publication date standards: 22.7.2020
SKU: NS-999489
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: British technical standard
Category: Technical standards BS
ISBN: 978 0 580 89909 6 Status: Definitive
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